We supply from beginning to end service for your LED factory. Manufacturing and test equipment, high-end LED material and parts or SKD kits and the best engineers to support you in any need.


Recent growth in LED technology and solid-state lighting has provided the electronics manufacturing industry with viable solutions for its addition into today’s electronic devices. LEDs have become an alternative light source to conventional incandescent and fluorescent bulbs. The electronics manufacturing industry sees the greatest benefits from the small size and lower power consumption of today’s LEDs.

There also is the recent trend to use “green technology” in consumer and commercial electronics. LED components offer high brightness and power efficiency, as well as lower carbon emissions than traditional lighting technologies. This aspect has made LED lighting popular with government organizations, which are now installing LED lighting in public places and government offices worldwide.

When used for illumination purposes, LEDs are more cost-effective than traditional lighting sources. Thus, the global LED component market is witnessing an increasing demand. As a result, companies in the surface-mount technology (SMT) industry are expanding their manufacturing capabilities to meet this demand. High brightness LED components currently are experiencing high growth as the backlighting application in TVs is shifting from traditional CCFL technology to LEDs. The range of new and potential applications for LEDs in electronics is practically endless.

In order for electronics manufacturers to get LEDs into their products, we must use one of two methods: hand assembly or automated assembly. Hand assembly is where skilled technicians carefully place individual LED components onto circuit boards using specialized tooling.

On the other hand, automated assembly uses the company’s existing SMT equipment to quickly and efficiently place thousands of LED components every hour. Tarsier offers a SMT equipment capable of placing multiple components on a circuit board at one time, increasing the overall production rates while decreasing labor costs.

Pick and place

The principle of using vacuum pressure and precision nozzles to enable component placement is repeated in every type of SMT equipment. There are five distinct stages of the pick-and-place process:

  • Picking: components are withdrawn from a feeder or tray by a vacuum nozzle
  • Holding: components are steadied for rapid movement while the machine detects proper alignment
  • Transport: components are transferred from the picking location to the PCB for assembly
  • Placement: components are lowered to their specific location on the circuit board
  • Release: components are released by the nozzle, which returns to the picking area to restart the process